semiconductor manufacturing equipment suppliers
on this page
A chip factory is a chain of specialized tools. Lithography prints patterns. Deposition adds thin films. Etch removes selected material. Cleaning removes particles. Inspection finds defects. Test and packaging connect finished dies and reject bad parts. No one supplier covers the full chain.
market evidence as of september 2026
total equipment: SEMI forecasts $165.9 billion of new equipment sales in 2026, up 23.2% from 20251
wafer-fab equipment: $143.9 billion of the 2026 forecast
test equipment: $15.3 billion forecast for 2026
assembly and packaging: $6.7 billion forecast for 2026
forecast, not revenue: the figures can change as factory plans and demand change
the manufacturing chain
| step | what the tool does | example suppliers |
|---|---|---|
| lithography | projects a circuit pattern onto light-sensitive material | asml, canon, nikon |
| deposition | adds controlled layers of conductor or insulator | applied materials, lam research, tokyo electron |
| etch | removes exposed material to form features | lam research, applied materials, tokyo electron |
| clean and coat | removes contamination and applies photoresist | tokyo electron, screen |
| inspection and measurement | finds defects and measures process variation | kla, asml, hitachi high-tech |
| test and packaging | tests dies and connects them into usable packages | advantest, teradyne, asmpt, besi |
The supplier lists are examples, not market-share rankings. A company may lead one narrow tool category and compete in another. Market shares also depend on how analysts divide product classes.
asml and lithography
Extreme-ultraviolet (EUV) lithography uses 13.5 nanometer light to print the smallest production features. ASML is the only commercial supplier of EUV scanners. Deep-ultraviolet (DUV) tools remain necessary for many other layers and process nodes.
ASML reported €9.3 billion of sales in the second quarter of 2026. It sold 86 new lithography systems, including one High-NA EUV system. High numerical aperture, shortened to High-NA, increases the optical system’s ability to resolve small features.2
The company said its 2026 production capacity was about 65 low-NA EUV systems and 130 DUV immersion systems. It planned to add 30% to each capacity in 2027. These are company plans, not a count of systems already sold.
deposition, etch, and clean
Applied Materials, Lam Research, and Tokyo Electron sell overlapping sets of process tools. Their equipment shapes transistors, wires, memory cells, and the layers used in advanced packages.
Applied Materials said in May 2026 that it expected its semiconductor-equipment business to grow by more than 30% during calendar 2026.3 Tokyo Electron’s fiscal 2026 materials also identified investment in memory and advanced packaging for generative AI as a demand source.4 These company statements describe demand exposure; they do not prove that every AI hardware order uses a particular supplier.
inspection and process control
Inspection tools find particles, pattern defects, and electrical faults before more manufacturing cost is added. Measurement tools track dimensions, film thickness, alignment, and other process variables. This work becomes harder as features shrink and packages combine more dies.
KLA reported $3.66 billion of revenue for the quarter ending June 30, 2026.5 Revenue is a useful measure of company scale, but it is not a market-share estimate for each tool category.
hbm and advanced packaging
High-bandwidth memory (HBM) adds manufacturing demand outside the logic die. Suppliers need tools for thin wafers, vertical connections, bonding, molding, inspection, and final test. SEMI forecasts 2026 sales of:
- $38.8 billion for DRAM equipment;
- $15.3 billion for semiconductor test equipment;
- $6.7 billion for assembly and packaging equipment.1
Those categories overlap the AI supply chain, but not all of their sales serve AI products.
geographic and policy risk
Equipment moves through a cross-border supply chain. Tool modules, light sources, optics, chemicals, and replacement parts may come from different countries. Export controls can restrict a tool, component, service, or destination. Earthquakes, power failures, logistics problems, and factory interruptions can also stop delivery or service.
The practical risk is not captured by a single country percentage. For each process step, ask:
- which exact tool and configuration does the factory require?
- can another qualified tool run the same process?
- how long would qualification take?
- are spare parts and field engineers available?
- does an export license apply to the tool, software, update, or service?
reading market forecasts
SEMI’s July 2026 forecast expects total equipment sales to reach $229.5 billion in 2028. It uses supplier input, reported market statistics, and factory-project data.1 The number is a forecast, not booked industry revenue. It should be cited with its publication date and market definition.
The September 2025 version of this page mixed total-equipment forecasts, fab spending, company revenue, and narrow product shares. Those measures answer different questions. This revision keeps them separate and removes unsupported shares and supplier revenue dependencies.
references
[1] SEMI. (2026, July 14). Global semiconductor equipment sales forecast to reach $229 billion in 2028.
[2] ASML. (2026, July 15). Second-quarter 2026 financial results.
[3] Applied Materials. (2026, May 21). Second-quarter 2026 results.
[4] Tokyo Electron. (2026). Investor-relations reports for the year ending March 31, 2026.
[5] KLA. (2026, July 28). Fiscal 2026 fourth-quarter and full-year results.